Electronics assembly technology - Endurance test methods for solder joint of area array type package surface mount devices Ingestion-build-51747 d) A segregation test has

d)      A segregation test has been introduced

BS EN 1537 is a European Standard that discusses execution of special geotechnical works

BS EN 13593 provides you with dimensions and tolerance requirements for free carrying sacks or liners

ISO 8130‑11 provides you with the procedure of the Inclined-plane flow test

Electronics assembly technology - Endurance test methods for solder joint of area array type package surface mount devices Ingestion-build-51747 d) A segregation test has1 Scope This part of IEC 62137 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and