Si wafer (100), 3 "dia x0.5 mm, 2sp, N type, Undoped, R>1000 ohm-cm - SIUa76D05C2R1000 active surface area 25 cm2 Size Distribution
$94.64
Description
Size Distribution
005 ohm-cm (If you would like to measure the resistivity accurately
Melting point: Does not melt congruently
The fully diamond sintered blade is suitable for low speed cutting ( under 3000 RPM) of oxide single crystals or any brittle crystal
Si wafer (100), 3 "dia x0.5 mm, 2sp, N type, Undoped, R>1000 ohm-cm - SIUa76D05C2R1000 active surface area 25 cm2 Size DistributionSingle crystal Si, Resistivity: >1,000 ohm CM Size: 3" diameter x 0. 5 mm Orientation: (100) Polish: Two sides polished Surface roughness: < 5A Related Products Other Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater
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