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Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) shop-only • Sheet-fed process
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) shop-only • Sheet-fed process
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Description
• Sheet-fed process
dissolution of the test sample
BS EN 1747-11 specifies a method for measuring the black smoke index of an ambient air sample
Users of this document are advised to inform themselves of the applicability or non-applicability for this document by their national responsible authorities
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) shop-only • Sheet-fed process
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