Corning EAGLE XG wafer 100mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagle100D05C2opt Mixing Jars Multiple battery analyzers can be

Multiple battery analyzers can be connected to 1 PC via an ethernet switch ($100

Sintering the pellet under a suitable temperature

Package            Container Sealed in Al Vacuumed Bag

Tired of grinding by hand

Corning EAGLE XG wafer 100mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagle100D05C2opt Mixing Jars Multiple battery analyzers can beFeatures: Corning EAGLE XG Glass Substrates Suggested Max. Use Temperature: 675 deg C (1,247 deg F ) Dimension: 100 mm (+ 0. 2mm) in diameter x 0. 5 mm(+ 0. 05mm) High transmission (75 80 %) Low defect densities Low ohmic values Both Sides Optically Clear with Surface Quality; 60 40 and Surface Roughness Ra: < 0. 5 nm RMS Edge : CNC ground Non effective area: 3. 0mm Border Highly transparent LCD and OLED applications For the properties of Corning