Bambu Lab AP Board Cover - H2D bondtech BMG extruder You get this bad boy
$19.99
Description
You get this bad boy
The Bambu Lab Liquid Glue can be cleaned easily from the print surface and from models
Eco-Friendly: PCTG is 100% recyclable
Filament Normal PA6-CF Bambu PA6-CF Bambu PAHT-CF Bambu PPA-CF Stiffness (Bending Modulus - XY
Bambu Lab AP Board Cover - H2D bondtech BMG extruder You get this bad boyOverview Covers and protects the AP board from dust and damage. Installation Learn more about AP Board Cover on Bambu Lab Wiki. In the Box AP Board Cover*1 Cable Tray Cover*1 BT2. 6 8 Screw*1 Compatibility H2D and H2D Laser Product Specifications Materials Plastic Packaging Size 122*122*262 mm Color Black Packaging Weight 0. 186 kg
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