G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Revision:SEMI G92-0315 - Superseded This Standard assumes that the

This Standard assumes that the GEM fundamental requirements and selected additional capabilities (as specified in § 13) have been implemented on the IBSEM equipment

SEMI D58-0310 (first published)

The first stack (refer to Figure 1) is a BWS pair of 775 µm thick wafers following TSV formation and the bonding operation

SEMI D19-1019 (technical revision)

G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Revision:SEMI G92-0315 - Superseded This Standard assumes that theThe purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die bonding process. This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. Only the mechanical interfaces for the tape frame cassette are specified. Materials kinds