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G08900 - SEMI G89 - リードフレームのストリップ寸法の規格 Revision:SEMI G89-0211 - Superseded SEMI T3-0302 (Reapproved 1108)

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SEMI T3-0302 (Reapproved 1108)

本スタンダードは,global Information & Control Technical Committeeで技術的に承認されている。現版は2013年3月14日,global Audits and Reviews Subcommitteeにて発行が承認された。2013年4月にwww

適切にパッケージされ,充填され

The defects are induced or enhanced by oxidation cycles encountered in normal device processing

G08900 - SEMI G89 - リードフレームのストリップ寸法の規格 Revision:SEMI G89-0211 - Superseded SEMI T3-0302 (Reapproved 1108)global Assembly & Packaging Committee20111221global Audits and Reviews Subcommittee20112www. semiviews. org www. semi. org Referenced SEMI Standards None.

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