Understanding Semiconductor Technology & Business US 06/01/26 StdPbc-0621 1 — Mechanical Specification for

1 — Mechanical Specification for Boxes and Pods Used to Transport and Store 300 mm Wafers

31 — Specification for Dichlorosilane (SiH2Cl2) in Cylinders

5-0698 (Reapproved 0706)

This test method deals only with junction-to-case or mounting surface measurements of thermal resistance and limits itself to heat sink and fluid bath testing environments

Understanding Semiconductor Technology & Business US 06/01/26 StdPbc-0621 1 — Mechanical Specification forUNDERSTANDING SEMICONDUCTOR TECHNOLOGY & BUSINESS 1 day In Person Training June 1st, 2026 8: 00 5: 00 pm CT Early Bird Pricing $100 off Member $995 $895 Non Member $1095 $995 Aloft Austin South 4108 S I35 Frontage Road Austin, TX 78745 612 401 3281 The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into