A00200 - SEMI A2 - Specification for Surface Mount Assembler Smart Hookup (SMASH) Revision:SEMI A2-1019 - Superseded

<measured qualification parameter>

This Document defines three orthogonal reference planes as references for carrier dimensions

based on nominal wafer diameter

In the case of 150 mm wafers

A00200 - SEMI A2 - Specification for Surface Mount Assembler Smart Hookup (SMASH) Revision:SEMI A2-1019 - Superseded <measured qualification parameter>The purpose of this Standard is to provide a standardized automation interface specification to be used for the equipment control in an assembly line for printed circuit board (PCB) that uses surface mount technology (SMT). The purpose of this Standard is to provide an interface specification that replaces conventional electrical interface with a network connection and adds data communication capability. The scope of this Standard is to define an