P01800 - SEMI P18 - Specification for Overlay Capabilities of Wafer Steppers StdPbc-0714 This Guide is intended to

This Guide is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by defining the items/parameters needed to procure virgin silicon carrier wafers to be used in a 3DS-IC process

A prerequisite for quality and process control in manufacturing of silicon wafers and solar cells is the traceability and track ability of the individual wafers

SEMI MS5-1107 (first published)

with an MFC that has been equalized to ambient conditions for 24 hours before the application of power

P01800 - SEMI P18 - Specification for Overlay Capabilities of Wafer Steppers StdPbc-0714 This Guide is intended toNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. Definitions for the overlay capabilities of wafer steppers are established, consistent with the primary application of wafer stepper (i. e., the manufacturing of very large scale integrated circuits). Also included are