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SEMI107 Printing, Curing, and Characterization Methods for Printable Conductors StdTpc-Package & Chip Carrier Tooling SEMI C96-1121 (technical revision)
SEMI107 Printing, Curing, and Characterization Methods for Printable Conductors StdTpc-Package & Chip Carrier Tooling SEMI C96-1121 (technical revision)
$45.00
Description
SEMI C96-1121 (technical revision)
some of which are covered by Related Documents
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SEMI107 Printing, Curing, and Characterization Methods for Printable Conductors StdTpc-Package & Chip Carrier Tooling SEMI C96-1121 (technical revision)Course Description This course covers all the basics of using printable conductors for additive manufacturing of circuits on polymer substrates. Students will learn about the different types of classes of conductive inks available and how to characterize their performance and cost. Students will also procure an overview of traditional and digital printing methods, drying curing sintering methods, and design and assembly differences compared to
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