G06800 - SEMI G68 - 空気環境における半導体パッケージのジャンクション部とケース間の熱抵抗測定の試験方法 StdPbc-0217 It defines also how to

It defines also how to apply an orientation fiducial mark on an otherwise unmarked wafer

lower space requirement

1  This Specification describes a method for data acquisition EDA Applications to request process and data from equipment to be communicated in an automated fashion by the equipment

Compared with damp heat (DH) tests

G06800 - SEMI G68 - 空気環境における半導体パッケージのジャンクション部とケース間の熱抵抗測定の試験方法 StdPbc-0217 It defines also how toglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : Referenced SEMI Standards SEMI G30 Test Method for Junction to Case Thermal Resistance Measurements of Ceramic Packages SEMI G32 Guideline for Unencapsulated Thermal Test Chip SEMI G38 Test Method for Still and Forced Air Junction to Ambient Thermal Resistance Measurements of Integrated Circuit Packages SEMI