MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Revision:SEMI MS1-0307 (Reapproved 0318) - Superseded except that it uses special

except that it uses special wafer holding fixtures to orient the wafer uniquely with respect to the X-ray goniometer

orgで入手可能になり，2004年11月発行に至る。初版は1990年。

SEMI 3D17-1217 (first published)

SEMI G4-89 (technical revision)

MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Revision:SEMI MS1-0307 (Reapproved 0318) - Superseded except that it uses special1 Purpose 1. 1 This Guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together. 2 Scope 2. 1 This Guide applies to targets that can be used with two common alignment processesinner surface alignment and outer surface alignment. 2. 2 This Guide