F03900 - SEMI F39 - Guide for Chemical Blending Systems StdPbc-0822 The presence of unwanted subsurface

The presence of unwanted subsurface p-n junctions may have deleterious effects on device operation

It provides terminology and methodology aimed at eliminating confusion regarding what previously has been referred to as MFC ‘response time

SEMI E149 — Guide for Equipment Supplier-Provided Documentation for the Acquisition and Use of Manufacturing Equipment

SEMI E30-1296 (technical revision)

F03900 - SEMI F39 - Guide for Chemical Blending Systems StdPbc-0822 The presence of unwanted subsurfaceThis Guide establishes terminology, blend technique classification(s), system specification(s), performance characterization, and qualification methods for liquid chemical blending equipment. This Guide applies to chemical blending equipment used within a semiconductor manufacturing facility for the purposes of producing chemicals used for wafer processing. Referenced SEMI Standards (purchase separately) SEMI C1 Guide for the Analysis of Liquid