G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Revision:SEMI G97-0116 - Superseded E本スタンダードは2006年5月に編集上の修正がなされた。修正箇所は，¶10

E本スタンダードは2006年5月に編集上の修正がなされた。修正箇所は，¶10

Capacity tests are done by adding ppm levels of a given gaseous impurity to a pure zero gas and monitoring the effluent of the test purifier for active impurity species

the user should create a Site-Specific Facilities Services and Termination Matrix (refer to Table 2) that is submitted with the request for a quote

SEMI E22-0697 (Reapproved 0309)

G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Revision:SEMI G97-0116 - Superseded E本スタンダードは2006年5月に編集上の修正がなされた。修正箇所は，¶10NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Standard describes procedures for measuring the mechanical, physical, chemical, thermal, and electrical properties of leadframe tape. Equipment, sampling, and procedures are referred to in the individual test methods.