G09300 - SEMI G93 - ボール・グリッド・アレイ（BGA）パッケージ用はんだボールの測定方法 Revision:SEMI G93-0412 - Inactive 1 This Specification may be

1  This Specification may be applied to equipment that is compliant to SEMI E30 (GEM)

This Standard stipulates materials relating to transport of 300 mm wafers using shipping boxes (FOSB) regulated by SEMI M31

SEMI A2 — Specification for Surface Mount Assembler Smart Hookup (SMASH)

The procedures may be used by the material manufacturer for quality control or by a customer at incoming inspection

G09300 - SEMI G93 - ボール・グリッド・アレイ（BGA）パッケージ用はんだボールの測定方法 Revision:SEMI G93-0412 - Inactive 1 This Specification may beglobal Assembly & Packaging Technical Committee2012221global Audits and Reviews Subcommittee20124www. semiviews. org www. semi. org BGA Referenced SEMI Standards None.