3D02200 - SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications StdPbc-0721 This Specification covers virgin test

This Specification covers virgin test wafers in all standard wafer diameters from 2 inch to 300 mm

this Test Method only applies if the laser is Class 1 or Class 2

org Registration is final

Ambiguities and uncertainties regarding surface defects may be resolved by reference to this Guide

3D02200 - SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications StdPbc-0721 This Specification covers virgin testThe purpose of this Specification is to establish basic physical dimensions for the glass carrier intended to be used for panel level package processing. This Specification specifies physical dimensions of the glass carrier for use in panel level packaging (PLP) applications.<br><br>This Specification describes glass carrier with 510 mm 515 mm and 600 mm 600 mm panel sizes as specified by the relevant SEMI 3D20. Referenced SEMI Standards (purchase